对某产品芯轴整体镀金工艺改进-《机械与电子》

文章信息/Info

作者:: 仲志新¹ 董铭江¹ 李建华² 范筱琳²; (1.中国人民解放军驻一二八厂军事代表室,贵州贵阳 550009; 2.贵州华阳电工有限公司,贵州贵阳 550009)

Author(s):: ZHONG Zhixin¹ DONG Mingjiang¹ LI Jianhua² FAN Xiaolin²; (1.Military Representative Chinese PLA 128 plant room,Guiyang 550009,China; 2.Guizhou Huayang Electrical Co.,Ltd., Guiyang 550009,China)

摘要:: 阐述了旋转开关式环位置传感器产品的芯轴在电镀过程中出现的问题及解决方法。为了起到良好的导电性和耐磨性,该部件要求在外圆金属表面进行Cu/Ep·Ni1～3Au3～5hd表面处理工艺。在实现这一表面处理过程中出现了很多的问题,电镀的合格率最初不足10%,且由于该部件要求导电环表面高出填料表面0～0.01 mm,给产品的电镀、退镀都造成了困难,废品率极高。通过过程监控,发现影响电镀质量的因素是前处理不到位。对电镀的前处理过程进行分析、改进,使部件生产过程及表面处理的前处理过程得到完善,从而提高镀层的外观与结合力

Abstract:: This paper describes a core shaft similar to a rotary switch in a location sensor, describes problems occurring in the product during the plating process and provides a solution to said problem. In order to improve conductibility and abrasion resistance, the part must have an exterior metal surface having a Cu/Ep·Ni1～3Au3～5hd surface treatment. A number of problems emerged during surface treatment process, and the pass rate of plating was initially less than 10%. The high requirements for the filling surface of the conduct ring, between 0 and 0.01 mm, made it difficult to manufacture the plate and the back plate. As a result, a high percentage of products were rejected. By conducting process monitoring, we found a key factor affecting the plating quality was insufficient pre-treatment. By conducting analysis and improving the plating pre-treatment process, the parts manufacturing process and the surface treatment process was perfected. Thus the appearance and binding force of coating was improved, and the pass rate of plating parts increased from 10% to 80%, so that more products could be successfully delivered.