[1]焦文龙,苑伟政.微谐振式压力传感器的系统级建模与仿真[J].机械与电子,2016,(06):21-25.
　JIAO Wenlong,YUAN Weizheng.System Level Modeling and Simulation of a Micro Resonant Pressure Sensor[J].Machinery & Electronics,2016,(06):21-25.
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微谐振式压力传感器的系统级建模与仿真
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《机械与电子》[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2016年06期
页码:
21-25
栏目:
设计与研究
出版日期:
2016-06-25

文章信息/Info

Title:
System Level Modeling and Simulation of a Micro Resonant Pressure Sensor
作者:
焦文龙; 苑伟政
（西北工业大学机电学院，陕西 西安 710072）
Author(s):
JIAO Wenlong; YUAN Weizheng
(School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China)
关键词:
微机电系统; 系统级; 仿真; 压力传感器; 参数化
Keywords:
MEMS;  system level;  simulation;  pressure sensor;  parameterized
分类号:
TP391;TN402
文献标志码:
A
摘要:
具有微型化、多域耦合等特点的MEMS传感器对设计具有高精度、高效率、迭代设计、结构与电路联合设计等要求。基于组件库或集总参数的MEMS系统级设计方法虽然满足了这些要求，但在面向特定器件的定制化设计方面却略显不足。以一MEMS谐振式压力传感器为例，提出了一种全参数化系统级建模与仿真方法。在建立的详细数学模型基础上，通过硬件描述语言对传感器谐振子按照详细拓扑结构进行了建模与仿真。仿真结果和实验结果的对比显示这是一种满足MEMS设计要求的建模与仿真方法。
Abstract:
The design of MEMS transducers characterized by microminiaturization and multi-domain coupling and the like requires high accuracy, high efficiency, iterative design, and co-design of structure and IC. Although the MEMS system-level design method based on component library or lumped parameters meets these requirements, it is insufficient for customization design of specific MEMS device. Taking a resonant pressure sensor as an example, a fully parameterized system level design method is put forward. Based on the detailed mathematical model, the resonator of the sensor is modeled and simulated with a hardware description language. The simulation process and results show that it is a promising method that fulfills MEMS design.

参考文献/References:

[1]Stemme G. Resonant silicon sensors[J]. Journal of Micromechanics and Microengineering, 1991(1): 113-125.
[2]霍鹏飞. 微机电系统的多端口组件网络方法系统级建模研究[D]. 西安:西北工业大学, 2004.
[3]Younis M I. MEMS linear and nonlinear statics and dynamics[M]. Berlin: Springer, 2011.
[4]Ren S, Yuan W Z, Qiao D Y. A micromachined pressure sensor with integrated resonator operating at atmospheric pressure[J]. Sensors, 2013(13): 17006-17024.
[5]Bao M H. Analysis and design principles of MEMS devices[M]. Amsterdam: Elsevier, 2005.
[6]Shah K, Singh, Zayegh A. Modeling and analysis of fringing and metal thickness effects in MEMS parallel plate capacitors[J]. Proc. of SPIE, 2006, 60305: 603511.

备注/Memo

备注/Memo:
收稿日期：2016-04-21
作者简介：焦文龙（1985-），男，山东高密人，博士研究生，研究方向为MEMS系统级建模与仿真。
更新日期/Last Update: 2016-06-25