[1]汪学方.内置皮拉尼计的硅通孔圆片级MEMS真空封装研究[J].机械与电子,2018,(10):7-11.
　WANG Xuefang.Research on Built-in Pilani Gauge Wafer Level MEMS Vacuum Packaging Based on TSV[J].Machinery & Electronics,2018,(10):7-11.
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内置皮拉尼计的硅通孔圆片级MEMS真空封装研究
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《机械与电子》[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2018年10期
页码:
7-11
栏目:
设计与研究
出版日期:
2018-10-24

文章信息/Info

Title:
Research on Built-in Pilani Gauge Wafer Level MEMS Vacuum Packaging Based on TSV
文章编号:
1001-2257(2018)10-0007-05
作者:
汪学方
(华中科技大学机械科学与工程学院,湖北 武汉 430074)
Author(s):
WANG Xuefang
(School of Mechanical Science and Engineering, Huazhong University of Science and Technology,Wuhan 430074,China)
关键词:
硅通孔;  圆片级;  真空封装
Keywords:
TSV;  wafer level;  vacuum packaging
分类号:
TN305
文献标志码:
A
摘要:
针对现有的圆片级真空封装存在检测难、易泄漏等问题,提出了内置皮拉尼计的硅通孔圆片级MEMS真空封装方法。研制了用于圆片级真空封装导线互连的硅通孔,探讨了玻璃盖板与硅圆片之间阳极键合工艺与硅圆片与硅圆片之间的金硅共晶键合工艺,研制了用于检测封装壳体内部真空度的皮拉尼计; 研制了内置皮拉尼计的4英寸硅通孔圆片级真空封装,研制了低温激活非蒸散型吸气剂。实验研究表明,该研究解决了长时间保持真空度的问题。
Abstract:
In order to solve the problems of difficult detection and easy leakage in wafer level vacuum packaging, a through silicon vias(TSV)wafer level MEMS vacuum packaging method with a built-in Pilani gauge was proposed. A through silicon vias for the wires interconnect of wafer level vacuum packaging was developed, the bonding process of the anode bonding between the glass cover plate and the silicon wafer and the gold silicon eutectic bonding between silicon wafer and silicon wafer was developed and discussed, A Pilani gauge for detecting the vacuum degree inside the package was developed. A 4 inch TSV wafer level vacuum package with a built-in Pilani gauge was developed. A low temperature activated non-evaporative getter was developed. Test results show that the research can realize long-time vacuum of wafer level vacuum packaging

参考文献/References:

[1] Mitchell J,Lahiji G R,Najafi K.Encapsulation of vacuum sensors in a wafer level package using a gold-silicon eutectic[J].International Conference on Solid-State Sensors,2005,1:928-931.
[2] Sparks D,Massoudansari S,Najafi N.Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs[J].Journal of Micromechanics and Microengineering,2005,15(8):1560-1564.
[3] 师帅,吕植成,汪学方,等.带有TSV的硅基大功率LED封装技术研究[J].半导体光电,2013,34(4): 621-625.
[4] Shi S,Wang X,Xu C,et al.Simulation and fabrication of two Cu TSV electroplating methods for waferlevel 3D integrated circuits packaging[J]. Sensors and Actuators A:Physical, 2013,203(12):52-61.
[5] Shi S,Wang X F,Xu M H,et al.Deep wet etching process of Pyrex glass for vacuum packaging[C]//International Conference on Electronic Packaging Technol and High Density Packaging,2012:44-48.
[6] Shi S, Wang X F, Xu C L, et al. Fabricating processes of free-standing silicon nitride thin film for MEMS devices[C]//International Conference on Electronic Packaging Technol,2013:23-26.
[7] Shi S,Wang X F,Xu C L,et al.Modeling and Simulation of Cu TSV electroplating for wafer-level MEMS vacuum packaging[C]//International Conference on Electronic Packaging Technol,2013: 68-72.

备注/Memo

备注/Memo:
收稿日期:2018-05-11
作者简介:汪学方(1970-),男,湖北武汉人,博士,副教授,研究方向为MEMS芯片及其封装技术。
更新日期/Last Update: 2018-10-24