[1]张先锋,王恒远,赵 政,等.自热式印制板加热性能分析与评估[J].机械与电子,2021,(05):26-30.
 ZHANG Xianfeng,WANG Hengyuan,ZHAO Zheng,et al.Analysis and Evaluation to Heating Performance of PCB with Self-heating[J].Machinery & Electronics,2021,(05):26-30.
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自热式印制板加热性能分析与评估()
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机械与电子[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2021年05期
页码:
26-30
栏目:
设计与研究
出版日期:
2021-05-24

文章信息/Info

Title:
Analysis and Evaluation to Heating Performance of PCB with Self-heating
文章编号:
1001-2257(2021) 05-0026-05
作者:
张先锋王恒远赵 政魏 李
中国电子科技集团公司第三十八研究所,安徽 合肥 230088
Author(s):
ZHANG XianfengWANG HengyuanZHAO ZhengWEI Li
( No.38 Research Institute of CETC,Hefei 230088, China )
关键词:
印制板自加热参数分析性能评估
Keywords:
PCBself-heatingparameter analysisperformance evaluation
分类号:
V444.3 ; TN41
文献标志码:
A
摘要:
针对星载电子设备集成化、轻量化设计需求,基于机热一体化设计了一种自热式印制板,通过在多层印制板中埋置加热电阻实现其自加热功能.采用仿真分析,研究了印制板加热电阻布局、导热性能以及结构参数等对加热性能和力学特性的影响,完成自热式印制板样件研制和加热性能评估.研究结果表明,对印制板电路布局、结构参数进行优化设计,可以实现印制板温控区域良好的温度均匀性,满足航天产品温控要求.
Abstract:
According to the requirement of integrated and lightweight design for space-borne electronic equipment,a self-heating printed circuit board(PCB)? is designed by means of the mechanical and thermal integrated design.There are some heating resistors embedded in the multi-layer PCB, which is used as the thermal compensation of PCB.The influence of heating resistors layout,thermal conductivity and configuration parameters in the PCB on heating and mechanical performance is investigated with numerical simulation.A sample of PCB with self-heating was developed andevaluated.The results show that with optimal design of circuits and configuration parameters the heating performance of PCB can satisfy the demand of temperature control for the aerospace products with good temperature uniformity in the temperature control zone.

参考文献/References:

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相似文献/References:

[1]胡松涛,付 娟,王振收,等.高温度环境下大功率PCB板的设计[J].机械与电子,2015,(05):33.
 HU Songtao,FU Juan,WANG Zhenshou,et al.Designof High Power PCB in High Temperature Environment[J].Machinery & Electronics,2015,(05):33.

备注/Memo

备注/Memo:
收稿日期:2021-01-27
作者简介:张先锋(1979-),男,安徽阜阳人,博士,高级工程师,研究方向为电子设备环控设计.
更新日期/Last Update: 2021-05-26