[1]付建新,等.考虑热振耦合作用的车载功率模块引脚焊点疲劳寿命分析与优化[J].机械与电子,2025,(01):63-73.
　FU Jianxin,,et al.Fatigue Life Analysis and Optimization for Pin Solder Joints on Vehicle-mounted Power Module Considering Thermal and Vibration Coupling[J].Machinery & Electronics,2025,(01):63-73.
点击复制

考虑热振耦合作用的车载功率模块引脚焊点疲劳寿命分析与优化()
分享到：

《机械与电子》[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2025年01期
页码:
63-73
栏目:
机电一体化
出版日期:
2025-01-30

文章信息/Info

Title:
Fatigue Life Analysis and Optimization for Pin Solder Joints on Vehicle-mounted Power Module Considering Thermal and Vibration Coupling
文章编号:
1001-2257 ( 2025 ) 01-0063-11
作者:
付建新 1 ; 2 ;  3 ; 石文明 1 ;  2 ;  3 ; 李海威 1 ;  2 ; 陈岱岱 1 ;  2 ; 毛鑫杰 1 ; 2
1. 浙江省汽车电子智能化重点实验室,浙江 宁波 315048 ;
2. 宁波均胜新能源研究院有限公司,浙江 宁波 315048 ;3. 宁波普瑞均胜汽车电子有限公司,浙江 宁波 315048
Author(s):
FU Jianxin1 ;  2 ;  3 ;  SHI Wenming1 ;  2 ;  3 ;  LI Haiwei1 ;  2 ;  CHEN Daidai1 ;  2 ;  MAO Xinjie1 ; 2
( 1.Key Laboratory of Automotive Electronics Intelligentization of Zhejiang Province , Ningbo 315048 , China ;?
2.Ningbo Joyson Advanced Energy Research Institute Co. , Ltd. , Ningbo 315048 , China ;3.Ningbo Preh Joyson Automotive Electronics Co. , Ltd. , Ningbo 315048 , China )
关键词:
热振耦合; 引脚焊点; 疲劳寿命; 递增损伤叠加法; 响应面法
Keywords:
thermal and vibration coupling ;  pin solder joints ;  fatigue life ;  incremental damage superposition approach ;  response surface methodology
分类号:
U463
文献标志码:
A
摘要:
以车载功率模块引脚焊点为对象,研究热循环和随机振动共同作用下的疲劳寿命。建立功率电子装置整机有限元分析模型,采用 Anand 粘塑性材料本构模型和 Engelmaier 修正的 Coffin-Manson 方程分析了焊点热循环寿命。利用基于应变的 Coffin-Manson-Basquin 模型和考虑温度影响的递增损伤叠加法得到随机振动损伤。然后将热循环损伤和随机振动损伤进行累加得到焊点总的疲劳寿命。结果表明,在规定的热振耦合作用下,功率模块引脚焊点的疲劳寿命为 1 102.7 h ,温度对焊点的累积塑性变形和随机振动疲劳损伤均具有明显作用。最后通过响应面法,分析得到最优的焊点尺寸参数组合为上部直径 2.4 mm ,下部高度 0.6 mm ,优化后焊点的疲劳寿命提高了 1.2 倍。
Abstract:
Pin solder joints on vehicle-mounted power module is focused on to explore their fatigue lives under thermal cycle and random vibration conditions.By establishing finite element model of the whole power electronic device , Anand visco-plasticity constitutive model and Coffin-Manson equation adjusted by Engelmaier are used to calculate their thermal cycle lives.The damage caused by random vibration is obtained by utilizing strain-based Coffin-Manson-Basquin model and incremental damage superposition approach concerning thermal influence.Furthermore , the total fatigue lives of solder joints are calculated by superposing the damage caused by both thermal cycle and random vibration.The results show that the final fatigue life of solder joints on power module is calculated as 1 102.7 h when the specified thermal and vibration conditions are simultaneously loaded.Temperature has a significant effect on accumulated plastic deformation and random vibration fatigue damage.Finally , the optimal parameter combination of solder joints is recorded as 2.4 mm for upper diameter and 0.6 mm for lower height by adopting response surface methodology , resulting in an improvement of 1.2 times for fatigue life of solder joints.

参考文献/References:

[ 1 ] 高超,黄春跃,梁颖,等 . 热循环载荷下 POP 堆叠焊点应力分析与优化[ J ] . 焊接学报, 2023 , 44 ( 2 ): 74-82.

[ 2 ] 安彤,陈晓萱,秦飞,等 . 热,振及热振耦合条件下塑封球栅阵列含铅焊点失效分析[ J ] . 焊接学报,2021 , 42( 9 ): 49-54.
[ 3 ] CUDDALOREPATTA G , DASGUPTA A , et al.Multi scale modeling of the viscoplastic response of as-fabricated microscale p- free Sn3.0Ag0.5Cu solder interconnects [ J ] .Acta materialia , 2010 , 58 ( 18 ): 5989-6001.
[ 4 ] 刘江南,王俊勇,王玉斌 . 热循环加载下电子封装结构的疲劳寿命预测[ J ] . 电子元件与材料,2022 , 41 ( 9 ):987-993.
[ 5 ] 李跃,田艳红,丛森,等 .PCB 组装板多器件焊点疲劳寿命跨尺度有限元计算[ J ] . 机械工程学报,2019 , 55( 6 ): 54-60.
[ 6 ] 秦飞,别晓锐,陈思,等 . 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型[ J ] . 振动与冲击, 2021 , 40 ( 2 ):164-170.
[ 7 ] WEI X , ALAHMER A , ALI H , et al.Effect of temperature on the low cycle fatigue properties of BGA solder joints [ J ] .Microelectronics and reliability , 2023 , 146 : 115031.
[ 8 ] 林健,雷永平,吴中伟,等 . 板级焊点结构的热疲劳及机械疲劳性能分析[ J ] . 稀有金属材料与工程,2013 , 42( 9 ): 1874-1878.
[ 9 ] 潘碑,王宏光,李宇轩,等 . 温度循环和随机振动载荷下堆叠封装焊点可靠性模拟研究[ J ] . 固体电子学研究与进展,2024 , 44 ( 2 ): 161-166.
[ 10 ] 倪艳,陈丹阳,蔡苗,等 .SiC 芯片封装纳米银烧结层的热机械分析及疲劳寿命预测[ J ] . 电子元件与材料,2024 , 43 ( 2 ): 238-245.
[ 11 ] 孙勤润,杨雪霞,张伟伟,等 . 基于正交法的 FBGA 焊点可靠性优化研究[ J ] . 微电子学, 2022 , 52 ( 1 ): 144-149.
[ 12 ] 许志鹏,刘婵,冯红翠 . 基于有限元和 RBF 神经网络的液压 支 架 前 连 杆 疲 劳 寿 命 预 测 [ J ] . 机 械 设 计,2024 , 41 ( 1 ): 110-116.
[ 13 ] 于敬丹,王儒,吴文志,等 . 基于变可信度近似模型的BGA 焊点 可 靠 性 预 测 与 优 化 方 法 [ J ] . 焊 接 学 报,2024 , 45 ( 1 ): 10-16.
[ 14 ] LUO Y H , GUO P , GAO J F , et al.Application of design-expert response surface methodology for the prediction of rejuvenated asphalt fatigue life [ J ] .Journal of cleaner production , 2022 , 379 : 134427.
[ 15 ] 邱鑫,白梅杉,陆文杰,等 . 基于响应面法的单元发动机喷注器优化设计[ J ] . 上海航天, 2024 , 41 ( 2 ): 130-136.
[ 16 ] 赵福斌,仇原鹰,贾斐,等 . 热振加载条件下电子封装结构的疲劳寿命分析[ J ] . 西安电子科技大学学报(自然科学版),2019 , 46 ( 2 ): 54-60.
[ 17 ] QI H Y , OSTERMAN M , PECHT M.A rapid life prediction approach for PBGA solder joints under combined thermal cycling and vibration loading conditions [ J ] .IEEE Transactions on components and packaging technologies , 2009 , 32 ( 2 ): 283-292.

备注/Memo

备注/Memo:
收稿日期: 2024-06-24
基金项目:宁波市汽车电子智能化创新联合体项目( 2022H007 )
作者简介:付建新 ( 1988- ),男,河南郑州人,博士,高级工程师,研究方向为车载电源系统多物理场环境可靠性。
更新日期/Last Update: 2025-03-07