参考文献/References:
[1].HAHN P O. The 300 mm silicon wafer—a cost and technology challenge[J].Microelectronic engineering,2001,56(1 /2):3-13.
[2].韩其锋,吴明明.大直径太阳能硅片高效低损耗线切割技术研究[J].机电产品开发与创新,2012,25(6):171-173.
[3].PUNTURAT J, TANGWARODOMNUKUN V, DUMKUM C.Surface characteristics and damage of monocrystalline silicon induced by wire-EDM[J]. Applied surface science,2014, 320: 83-92
[4].范圣耀. 高速走丝多次线切割电极丝动态特性及行为稳定技术研究[D].无锡:江南大学,2009.
[5].丁成才,黄晓华,邱明波,等.往复走丝电火花线切割机床电极丝恒张力装置性能研究[J].电加工与模具,2018(1):20-24.
[6].蒋近,戴瑜兴,彭思齐.多线切割机控制系统的研制[J].中国机械工程,2010,21(15):1780-1784.
[7].张义兵,戴瑜兴,袁巨龙, 等. 多线切割机线张力控制系统设计实现 [J]. 机械工程学报, 2009, 45(5): 295-300.
[8].SAHA P ,TARAFDAR D ,PAL S K ,et al.Multi-objective optimization in wire electrical discharge machining of TiC reinforced composite through Ncuro-Gcnetic technique[J].Applied soft computing,2013,13(4):2065-2074.
[9].YAN M T , FANG C C . Application of genetic algorithm-based fuzzy logic control in wire transport system of wire-EDM machine[J]. Journal of materials processing technology, 2008,205(1/2/3):128-137.
[10] 王振华. 实用轴承手册[M]. 上海:上海科学技术文献出版社,1990.