[1]龚宝龙.芯片偏置对散热器倾斜程度影响分析[J].机械与电子,2015,(08):3-5.
　GONG Baolong.Effect Analysis of Chip Offset on Heat Sink Tilt Degree[J].Machinery & Electronics,2015,(08):3-5.
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芯片偏置对散热器倾斜程度影响分析
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《机械与电子》[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2015年08期
页码:
3-5
栏目:
设计与研究
出版日期:
2015-08-26

文章信息/Info

Title:
Effect Analysis of Chip Offset on Heat Sink Tilt Degree
文章编号:
1001-2257(2015)08-0003-03
作者:
龚宝龙
(浪潮电子信息产业股份有限公司高效能服务器与存储技术国家重点实验室,山东 济南 250101)
Author(s):
GONG Baolong
(Inspur Electronics Information Industry Co., Ltd., State Key Laboratory of High-end Server and Storage Technology, Jinan 250101, China)
关键词:
芯片偏置;  散热器倾斜;  数值模拟;  位置分析
Keywords:
chip offset;  heat sink tilt;  numerical simulation;  location analysis
分类号:
TH124
文献标志码:
A
摘要:
采用有限元分析方法,仿真分析多种芯片偏心位置及散热器倾斜状况,比较散热器倾斜程度,优化芯片最佳的偏置位置,为芯片摆放提供最优建议。通过不同芯片位置对散热器倾斜程度影响的分析,得出以下结论:芯片向正上方偏移时,散热器的倾斜程度与芯片偏置距离呈线性关系。故芯片偏置距离越小,散热器的倾斜程度越小; 向上偏置一定距离后,还需再向左或向右偏置的话,都会增加散热器的倾斜程度; 芯片斜置时,平衡芯片几何中心至2个固定孔的距离,使芯片至2个固定孔距离差最小,可使散热器倾斜程度最小。
Abstract:
By applying finite element analysis method, the effect of chip offset on heat sink tilt phenomenon is analyzed. The best offset location of chip was identified and some suggestions for chips were provided. According to the results, the following conclusions were drawn: when the chip offset is located directly above, the relationship between tilt of heat sink and chip offset distance is linear. Thus, as the chip offset distance decreases, the tilt degree decreases. If the offset is moved upward a certain distance and if its direction is required to be towards the left or towards the right, tilt of heat sink will increase. When the chip offsets obliquely, minimizing the distance between chip and two fixed holes, the tilt degree of the heat sink tilt can be minimized.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2015-03-12
基金项目:国家高技术研究发展计划(863计划)(2013AA01A208)。
作者简介:龚宝龙(1988-),男,山西太原人,工学硕士,结构设计工程师,研究方向为结构设计、数值模拟分析。
更新日期/Last Update: 2015-08-26