[1]章玮玮,叶 锐.三维互联宽带数字收发微系统热设计[J].机械与电子,2019,(10):20-24.
 .Thermal Design of Three-Dimensional Interconnected Broadband Digital Transceiver Microsystem[J].Machinery & Electronics,2019,(10):20-24.
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三维互联宽带数字收发微系统热设计()
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机械与电子[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2019年10期
页码:
20-24
栏目:
设计与研究
出版日期:
2019-10-24

文章信息/Info

Title:
Thermal Design of Three-Dimensional Interconnected Broadband Digital Transceiver Microsystem
文章编号:
1001- 2257(2019)10- 0020- 05
作者:
章玮玮叶 锐
中国电子科技集团公司第三十八研究所,安徽 合肥 230088
Author(s):
 No.38ResearchInstituteofCETC,Hefei230088,China
关键词:
三维互联微系统热管理热设计传热路径
Keywords:
分类号:
TK172
文献标志码:
A
摘要:
为了提高三维互联微电子系统可靠性,展开微系统高效热管理研究并提出适应系统的热设计方案。针对三维构架下的宽带数字收发微系统,通过分析不同层间功率器件的传热路径和热阻组成,提出了节点优化的高效热管理方案,并采用热仿真软件分析了方案散热性能与系统热分布。发现系统最高温度出现在最不利传热路径上,器件最高壳温不超过80℃,满足微系统稳定运行的要求。该结果表明,对三维互联构架下关键传热材料与传热界面的优化设计可以有效降低路径上综合热阻,维持较低器件温度,满足设备工作需求。
Abstract:
Inordertoimprovereliabilityof3Dinterconnectedmicroelectronicsystem,efficientthermalmanagementwasstudiedandcorrespondingthermaldesignwasproposed.Aimingatthebroadbanddigitaltransceivermicrosystem with3Dinterconnectarchitecture,heattransferpathandthermalresistanceofpowerdevicesondifferentlayerswereanalyzed,andanoptimizedefficientthermalmanagementschemewasproposed.Moreover,thermalperformanceandheatdistributionin microsystem wereanalyzedbythermalsimulationsoftware.Throughsimulationanalysis,itwasfoundthatthehighesttemperatureinmicrosystemappearedonthemostunfavorableheattransferpath,andthemaximumshelltemperaturewasbelow80 ℃,whichsatisfiesstableoperationofthemicrosystem.Theresultsshowthattheoptimizeddesignofkeyheattransfermaterialandinterfacecanreducethecomprehensivethermalresistancesignificantly,andmaintainthelowcomponenttemperaturetomeetthedemandofsystem.

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备注/Memo

备注/Memo:
收稿日期:2019- 07- 03
基金项目:安徽省重点研究与开发计划(201904a05020078)
作者简介:章玮玮 (1991-),男,安徽桐城人,博士,工程师,研究方向为电子设备先进热管理。
更新日期/Last Update: 2019-10-24