[1]杨东旭,李宏军,郝晓博,等.面向晶圆图的芯片定位方法[J].机械与电子,2021,(10):32-36.
 YANG Dongxu,LI Hongjun,HAO Xiaobo,et al.Chip Location Method for Wafer Map[J].Machinery & Electronics,2021,(10):32-36.
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面向晶圆图的芯片定位方法()
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机械与电子[ISSN:1001-2257/CN:52-1052/TH]

卷:
期数:
2021年10期
页码:
32-36
栏目:
设计与研究
出版日期:
2021-10-24

文章信息/Info

Title:
Chip Location Method for Wafer Map
文章编号:
1001-2257 ( 2021 ) 10-0032-05
作者:
杨东旭李宏军郝晓博吴立丰
中国电子科技集团公司第十三研究所,河北 石家庄 050051
Author(s):
YANG Dongxu LI Hongjun HAO Xiaobo WU Lifeng
( The13th Research Institute of China Electronics Technology Group Corporation ,Shijiazhuang 050051 , China )
关键词:
芯片定位晶圆图路径规划LINE-2D
Keywords:
chip location wafer map path planning LINE-2D
分类号:
TP23
文献标志码:
A
摘要:
针对在依据晶圆图进行芯片分选时出现的芯片错位问题,提出了一种面向晶圆图的芯片定位方法.基于晶圆上芯片分布特点,采用跳点优化后的 A ? 算法进行路径规划,搜寻绕过工艺控制监测器( PCM )区域的最优路径,并按芯片的理论间隔距离移动,实现粗略定位;采用改进后的 LINE-2D 形状匹配算法对当前位置进行亚像素精度级的校正,实现精确定位.选择不同规格的晶圆在芯片分选机上进行多次实验,所提出的方法可基本解决芯片错位的问题,同时可提高芯片定位精度,满足芯片生产需求.
Abstract:
A chip location method for wafer map was proposed for the problem of chip dislocation during chips sorting based on wafer map. Based on the characteristics of chip distribution on the wafer , the A??algorithm optimized by jumping points was used to plan the optimal path that can bypass the process control monitor ( PCM ) area.Moving according to the theoretical interval distance of chips , rough positioning was carried out.The improved LINE-2D shape matching algorithm was used to correct the current position at the sub-pixel accuracy level to achieve precise positioning.Wafers of different specifications was selected to conduct multiple experiment on a chip sorting machine.The proposed location method was used to locate the chips on the wafer on the chip sorting equipment.The proposed method can solve the problem of chip dislocation basically , improve the chip location accuracy , and meet the needs of chip production.

参考文献/References:

[1] 卢荣胜,吴昂,张腾达,等 . 自动光学(视觉)检测技术及其在缺陷检测中的应用综述[ J ] . 光学学报,2018 , 38( 8 ): 23-58.

[2] NAKAZAWA T , KULKARNI D V.Wafer map defect pattern classification and image retrieval using convolutional neural network [ J ] . IEEE Transactions on semiconductor manufacturing , 2018 , 31 ( 2 ): 309-314.
[3] YAN L.A PCA-based PCM data analyzing method for diagnosing process pailures [ J ] . IEEE Transactions on semiconductor manufacturing , 2006 , 19 ( 4 ): 404-410.
[4] 戴威,尹周平,吴光华 . 芯片剥离过程分析[ J ] . 机械制造,2011 , 49 ( 3 ): 48-50.
[5] 褚金星 . 面向排列精度的 LED 高速分选工艺及优化[ D ] . 武汉:华中科技大学,2015.
[6] 寸毛毛,卢军 . 基于改进 Hu 矩和矩形拟合的芯片识别定位算[ J ] . 包装工程, 2018 , 39 ( 3 ): 151-156.
[7] 周琪琪,孙一兰,王诗宇,等 . 基于图像分割的芯片定位在检测系统中的应用[ J ] . 组合机床与自动化加工技术,2020 ( 8 ): 114-117.
[8] 刘琛,袁小芳,田争鸣,等 . 基于点模式匹配的芯片缺陷检测算法研究[ J ] . 激光杂志, 2020 , 41 ( 1 ): 39-44.
[9] 赵晓,王铮,黄程侃,等 . 基于改进 A? 算法的移动机器人路径规划[ J ] . 机器人, 2018 , 40 ( 6 ): 903-910.
[10] HARABOR D , GRASTIEN A.Online graph pruning for pathfinding on grid maps [ C ]// Proceeding of the Twenty-Fifth AAAI Conference on Artificial Intelligence. San Francisco , USA , 2011 :1114-1119.
[ 11 ] STEFAN H , CEDRIC C , SLOBODAN L , et al.Gradient response maps for real-time detection of textureless objects [ J ] . IEEE Transactions on pattern analysis and machine intelligence , 2012 , 34 ( 5 ): 876-888.
[12] 蔡艳,叶连祥,孙大为,等 . 基于改进的 Zernike 矩亚像素边缘提取算法外螺纹非接触测量[ J ] . 上海交通大学学报,2014 , 48 ( 10 ): 1468-1472 , 1478.
[13] OTSU N.A threshold selection method from gray-level histograms [ J ] .IEEE Transactions on systems man and cybernetics , 1979 , 9 ( 1 ): 62-66.
[14] 邢培锐,童敏明,张俊升,等 . 基于 NCC 改进算法的SMT 电路器件定位[ J ] . 计算机应用, 2017 , 37 (增刊1 ): 194-197.

备注/Memo

备注/Memo:
收稿日期: 2021-07-13
作者简介:杨东旭 ( 1997- ),男,河北石家庄人,硕士研究生,研究方向为半导体设备智能制造;李宏军 ( 1970- ),男,河北石家庄人,研究员,研究方向为微波器件与电路.
更新日期/Last Update: 2021-11-10